DFT interview questions

27 DFT questions from the VLSI Design bank, written for Indian campus drives and tech interviews. Every question has a verified answer and an AI-tutor explanation on placd.

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1. What is Scan chain?

Junior
  1. A.register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing
  2. B.flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational
  3. C.on-chip decompressor and compactor letting a few scan pins drive hundreds of internal chains, cutting test time and data volume 50–100×
  4. D.slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects

Answer + AI explanation with Pro

2. Which term means: "flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational"?

Junior
  1. A.Test compression
  2. B.Logic BIST
  3. C.Scan chain
  4. D.Stuck-at fault model

Answer + AI explanation with Pro

3. Which statement is correct?

Junior
  1. A.Scan chain — register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing
  2. B.Scan chain — flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational
  3. C.Scan chain — test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD
  4. D.Scan chain — assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply

Answer + AI explanation with Pro

4. What is Stuck-at fault model?

Junior
  1. A.assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply
  2. B.flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational
  3. C.on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  4. D.slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects

Answer + AI explanation with Pro

5. Which term means: "assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply"?

Junior
  1. A.Stuck-at fault model
  2. B.Scan chain
  3. C.Test compression
  4. D.Transition delay fault

Answer + AI explanation with Pro

6. Which statement is correct?

Junior
  1. A.Stuck-at fault model — slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects
  2. B.Stuck-at fault model — register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing
  3. C.Stuck-at fault model — assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply
  4. D.Stuck-at fault model — on-chip decompressor and compactor letting a few scan pins drive hundreds of internal chains, cutting test time and data volume 50–100×

Answer + AI explanation with Pro

7. What is JTAG IEEE 1149.1?

Junior
  1. A.flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational
  2. B.register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing
  3. C.on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  4. D.test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD

Answer + AI explanation with Pro

8. Which term means: "test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD"?

Junior
  1. A.Logic BIST
  2. B.JTAG IEEE 1149.1
  3. C.Scan chain
  4. D.Transition delay fault

Answer + AI explanation with Pro

9. Which statement is correct?

Junior
  1. A.JTAG IEEE 1149.1 — test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD
  2. B.JTAG IEEE 1149.1 — on-chip decompressor and compactor letting a few scan pins drive hundreds of internal chains, cutting test time and data volume 50–100×
  3. C.JTAG IEEE 1149.1 — automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent
  4. D.JTAG IEEE 1149.1 — flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational

Answer + AI explanation with Pro

10. What is Transition delay fault?

Mid
  1. A.register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing
  2. B.assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply
  3. C.slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects
  4. D.pseudo-random patterns from an LFSR applied through scan and compressed into a MISR signature, enabling in-field self-test demanded by ISO 26262

Answer + AI explanation with Pro

11. Which term means: "slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects"?

Mid
  1. A.Stuck-at fault model
  2. B.Test compression
  3. C.Logic BIST
  4. D.Transition delay fault

Answer + AI explanation with Pro

12. Which statement is correct?

Mid
  1. A.Transition delay fault — slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects
  2. B.Transition delay fault — on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  3. C.Transition delay fault — test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD
  4. D.Transition delay fault — pseudo-random patterns from an LFSR applied through scan and compressed into a MISR signature, enabling in-field self-test demanded by ISO 26262

Answer + AI explanation with Pro

13. What is ATPG?

Mid
  1. A.automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent
  2. B.assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply
  3. C.slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects
  4. D.register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing

Answer + AI explanation with Pro

14. Which term means: "automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent"?

Mid
  1. A.ATPG
  2. B.Boundary scan
  3. C.Logic BIST
  4. D.Transition delay fault

Answer + AI explanation with Pro

15. Which statement is correct?

Mid
  1. A.ATPG — test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD
  2. B.ATPG — on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  3. C.ATPG — assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply
  4. D.ATPG — automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent

Answer + AI explanation with Pro

16. What is Test compression?

Mid
  1. A.assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply
  2. B.flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational
  3. C.on-chip decompressor and compactor letting a few scan pins drive hundreds of internal chains, cutting test time and data volume 50–100×
  4. D.automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent

Answer + AI explanation with Pro

17. Which term means: "on-chip decompressor and compactor letting a few scan pins drive hundreds of internal chains, cutting test time and data volume 50–100×"?

Mid
  1. A.Test compression
  2. B.Memory BIST
  3. C.Stuck-at fault model
  4. D.Scan chain

Answer + AI explanation with Pro

18. Which statement is correct?

Mid
  1. A.Test compression — slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects
  2. B.Test compression — test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD
  3. C.Test compression — on-chip decompressor and compactor letting a few scan pins drive hundreds of internal chains, cutting test time and data volume 50–100×
  4. D.Test compression — on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns

Answer + AI explanation with Pro

19. What is Boundary scan?

Mid
  1. A.slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects
  2. B.register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing
  3. C.automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent
  4. D.on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns

Answer + AI explanation with Pro

20. Which term means: "register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing"?

Mid
  1. A.Logic BIST
  2. B.Test compression
  3. C.Boundary scan
  4. D.Scan chain

Answer + AI explanation with Pro

21. Which statement is correct?

Mid
  1. A.Boundary scan — test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD
  2. B.Boundary scan — register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing
  3. C.Boundary scan — automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent
  4. D.Boundary scan — assumes a net is permanently 0 or 1; coverage of 98–99% is the usual production target because the model catches most manufacturing defects cheaply

Answer + AI explanation with Pro

22. What is Memory BIST?

Mid
  1. A.on-chip decompressor and compactor letting a few scan pins drive hundreds of internal chains, cutting test time and data volume 50–100×
  2. B.on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  3. C.automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent
  4. D.pseudo-random patterns from an LFSR applied through scan and compressed into a MISR signature, enabling in-field self-test demanded by ISO 26262

Answer + AI explanation with Pro

23. Which term means: "on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns"?

Mid
  1. A.Logic BIST
  2. B.JTAG IEEE 1149.1
  3. C.Memory BIST
  4. D.Scan chain

Answer + AI explanation with Pro

24. Which statement is correct?

Mid
  1. A.Memory BIST — on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  2. B.Memory BIST — pseudo-random patterns from an LFSR applied through scan and compressed into a MISR signature, enabling in-field self-test demanded by ISO 26262
  3. C.Memory BIST — flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational
  4. D.Memory BIST — register of cells at every I/O pin, controlled through the TAP, used to test board-level interconnect and program devices without physical probing

Answer + AI explanation with Pro

25. What is Logic BIST?

Senior
  1. A.pseudo-random patterns from an LFSR applied through scan and compressed into a MISR signature, enabling in-field self-test demanded by ISO 26262
  2. B.test access port with TDI, TDO, TCK, TMS and optional TRST, a 16-state TAP controller and mandatory instructions BYPASS, EXTEST and SAMPLE/PRELOAD
  3. C.on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  4. D.slow-to-rise or slow-to-fall model tested with launch-on-capture or launch-on-shift at-speed patterns, needed because stuck-at misses timing defects

Answer + AI explanation with Pro

26. Which term means: "pseudo-random patterns from an LFSR applied through scan and compressed into a MISR signature, enabling in-field self-test demanded by ISO 26262"?

Senior
  1. A.Test compression
  2. B.Transition delay fault
  3. C.Memory BIST
  4. D.Logic BIST

Answer + AI explanation with Pro

27. Which statement is correct?

Senior
  1. A.Logic BIST — on-chip controller running March algorithms such as March C- on embedded SRAMs at speed, reporting failures and driving repair via redundant rows or columns
  2. B.Logic BIST — flip-flops replaced by scan cells stitched into shift registers so any state can be loaded and observed through a few pins, turning sequential test into combinational
  3. C.Logic BIST — automatic pattern generation that sensitises a fault, propagates its effect to a scan output and justifies the inputs, with tools such as TetraMAX or Tessent
  4. D.Logic BIST — pseudo-random patterns from an LFSR applied through scan and compressed into a MISR signature, enabling in-field self-test demanded by ISO 26262

Answer + AI explanation with Pro

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